Journalartikel

Jahr der Veröffentlichung: 2017

Seiten: 119-125

Zeitschrift: Solid State Ionics

Bandnummer: 303

ISSN: 0167-2738

DOI Link: https://doi.org/10.1016/j.ssi.2017.02.012

Verlag: Elsevier

Abstract: 
Within thermoelectric generators, the chemical diffusion of a contact
material into the active thermoelectric material is a potential cause
for degradation, which has rarely been discussed in literature.
Frequently, this degradation phenomenon leads to major problems in
developing new modules and achieving long-term stability. In this study,
copper as one of the standard contact materials and lead telluride as
the state-of-the-art active material in the mid-temperature range are
investigated. Chemical diffusion experiments of copper in lead telluride
were carried out between 375 K and 795 K and the copper diffusion
profiles were obtained by Secondary Ion Mass Spectrometry (SIMS). The
evaluated chemical diffusion coefficient is lower than 10⁻¹³ cm²/s in the respective temperature range.

Harvard-Zitierstil: Schneider, C., Schichtel, P., Mogwitz, B., Rohnke, M. and Janek, J. (2017) Chemical diffusion of copper in lead telluride, Solid State Ionics, 303, pp. 119-125. https://doi.org/10.1016/j.ssi.2017.02.012

APA-Zitierstil: Schneider, C., Schichtel, P., Mogwitz, B., Rohnke, M., & Janek, J. (2017). Chemical diffusion of copper in lead telluride. Solid State Ionics. 303, 119-125. https://doi.org/10.1016/j.ssi.2017.02.012