Journalartikel

Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials


AutorenlisteKolb, H.; Sottong, R.; Dasgupta, T.; Mueller, E.; de Boor, J.

Jahr der Veröffentlichung2017

Seiten5057-5063

ZeitschriftJournal of Electronic Materials

Bandnummer46

Heftnummer8

ISSN0361-5235

eISSN1543-186X

DOI Linkhttps://doi.org/10.1007/s11664-017-5486-9

VerlagElectron Devices Society


Abstract
Low electrical and thermal contact resistances are a prerequisite for highly efficient thermoelectric generators. Likewise, certain measurement setups for characterization of thermoelectric materials rely on good-quality contacts between sample and setup. Detachable contacts are an interesting alternative to permanent contacting solutions due to ease of handling and nondestructive disassembly of valuable samples. Therefore, the applicability of gallium-based liquid metal solder as detachable contact material was studied, particularly with regard to compatibility of the solder with state-of-the-art thermoelectric materials CoSb3, Mg2Si, and FeSi2. Tungsten, nickel, chromium, and titanium were tested as protective coatings between the thermoelectric material and liquid metal solder. Electrical measurements showed that some materials form excellent and stable contacts with the solder for a limited temperature range. At higher temperatures, application of a protective layer was found to be necessary for all investigated materials. Tungsten and nickel showed promising results as protective layer.



Zitierstile

Harvard-ZitierstilKolb, H., Sottong, R., Dasgupta, T., Mueller, E. and de Boor, J. (2017) Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials, Journal of Electronic Materials, 46(8), pp. 5057-5063. https://doi.org/10.1007/s11664-017-5486-9

APA-ZitierstilKolb, H., Sottong, R., Dasgupta, T., Mueller, E., & de Boor, J. (2017). Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials. Journal of Electronic Materials. 46(8), 5057-5063. https://doi.org/10.1007/s11664-017-5486-9



Schlagwörter


COSB3IRON-DISILICIDELIQUID GALLIUMLiquid metalmaterial characterizationSEEBECK COEFFICIENTsolder


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