Sammelbandbeitrag

Aroma Profile Analyses of Filamentous Fungi Cultivated on Solid Substrates


AutorenlisteOrban, A; Fraatz, MA; Rühl, M

Erschienen inSolid State Fermentation : Research and Industrial Applications

HerausgeberlisteSteudler, S; Werner, A; Cheng, JJ

Jahr der Veröffentlichung2019

Seiten85-107

ISBN978-3-030-23674-8

eISBN978-3-030-23675-5

DOI Linkhttps://doi.org/10.1007/10_2019_87

SerientitelAdvances in Biochemical Engineering Biotechnology

Serienzählung169


Abstract

Filamentous fungi have been used since centuries in the production of food by means of solid substrate fermentation (SSF). The most applied SSF involving fungi is the cultivation of mushrooms, e.g., on tree stumps or sawdust, for human consumption. However, filamentous fungi are also key players during manufacturing of several processed foods, like mold cheese, tempeh, soy sauce, and sake. In addition to their nutritive values, these foods are widely consumed due to their pleasant flavors. Based on the potentials of filamentous fungi to grow on solid substrates and to produce valuable aroma compounds, in recent decades, several studies concentrated on the production of aroma compounds with SSF, turning cheap agricultural wastes into valuable flavors. In this review, we focus on the presentation of common analytical methods for volatile substances and highlight various applications of SSF of filamentous fungi dealing with the production of aroma compounds.




Zitierstile

Harvard-ZitierstilOrban, A., Fraatz, M. and Rühl, M. (2019) Aroma Profile Analyses of Filamentous Fungi Cultivated on Solid Substrates, in Steudler, S., Werner, A. and Cheng, J. (eds.) Solid State Fermentation : Research and Industrial Applications. Cham: Springer International Publishing, pp. 85-107. https://doi.org/10.1007/10_2019_87

APA-ZitierstilOrban, A., Fraatz, M., & Rühl, M. (2019). Aroma Profile Analyses of Filamentous Fungi Cultivated on Solid Substrates. In Steudler, S., Werner, A., & Cheng, J. (Eds.), Solid State Fermentation : Research and Industrial Applications (pp. 85-107). Springer International Publishing. https://doi.org/10.1007/10_2019_87


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