Konferenzpaper

How do you Feel about Cybersecurity? – A Literature Review on Emotions in Cybersecurity


Autorenlistevon Preuschen, A; Zimmermann, V; Schuhmacher MC

Erschienen inInternational Symposium on Technikpsychologie (TecPsy) 2023

HerausgeberlisteGereber, N; Zimmermann, V

Jahr der Veröffentlichung2023

Seiten1-13

ISBN978-83-66675-89-6

DOI Linkhttps://doi.org/10.2478/9788366675896-001

KonferenzInternational Symposium on Technikpsychologie (TecPsy 2023)


Abstract

Despite the relevance of emotions in explaining human behavior, emotions have traditionally been neglected in models explaining cybersecurity behavior. In recent years, however, the consideration of emotions has gained increasing interest. To enrich our understanding of emotions in the field of cybersecurity, this systematic review analyses 23 papers in terms of their emotion-related focus based on a categorization system derived from cybersecurity literature. The findings indicate that emotions are fundamental in a wide variety of cybersecurity processes and require further research. The analysis furthermore reveals five essential challenges to emotion research in cybersecurity, e.g., with regards to the conceptualization of emotions and the tools to measure them within the cybersecurity context. Finally, the articles provide recommendations for possible research avenues to address these posed challenges.




Zitierstile

Harvard-Zitierstilvon Preuschen, A., Zimmermann, V. and Schuhmacher MC (2023) How do you Feel about Cybersecurity? – A Literature Review on Emotions in Cybersecurity, in Gereber, N. and Zimmermann, V. (eds.) International Symposium on Technikpsychologie (TecPsy) 2023. Warsaw: Sciendo. pp. 1-13. https://doi.org/10.2478/9788366675896-001

APA-Zitierstilvon Preuschen, A., Zimmermann, V., & Schuhmacher MC (2023). How do you Feel about Cybersecurity? – A Literature Review on Emotions in Cybersecurity. In Gereber, N., & Zimmermann, V. (Eds.), International Symposium on Technikpsychologie (TecPsy) 2023. (pp. 1-13). Sciendo. https://doi.org/10.2478/9788366675896-001


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