Journalartikel

Jahr der Veröffentlichung: 1998

Seiten: 786-789

Zeitschrift: Surface Science

Bandnummer: 402-404

DOI Link: https://doi.org/10.1016/S0039-6028(97)01061-3

Verlag: Elsevier

Abstract: 

The underpotential deposition (UPD) of copper on to Pt(111) in the presence of chloride anions was studied by full-dynamical LEED-intensity analyses. A deformed (4×4) LEED pattern was observed at an emersion potential of 0.36 V vs. Ag/AgCl, right in between the two characteristic and well-separated peaks of the cyclic voltammogram (CV). Corresponding LEED intensity measurements and simulations of the integral-order beams indicate that the UPD of Cu forms a single pseudomorphic Cu layer on Pt(111).

Harvard-Zitierstil: Bludau, H., Wu, K., Zei, M., Eiswirth, M., Over, H. and Ertl, G. (1998) The structure of the underpotential deposition of copper on to Pt(111) in the presence of chloride anions: a LEED structure analysis, Surface Science, 402-404, pp. 786-789. https://doi.org/10.1016/S0039-6028(97)01061-3

APA-Zitierstil: Bludau, H., Wu, K., Zei, M., Eiswirth, M., Over, H., & Ertl, G. (1998). The structure of the underpotential deposition of copper on to Pt(111) in the presence of chloride anions: a LEED structure analysis. Surface Science. 402-404, 786-789. https://doi.org/10.1016/S0039-6028(97)01061-3