Journal article

A New Micro-Stereolithography-System based on Diode Laser Curing (DLC)


Authors listVehseto, Mark; Seitz, Hermann

Publication year2014

Pages2161-2166

JournalInternational Journal of Precision Engineering and Manufacturing

Volume number15

Issue number10

ISSN2234-7593

eISSN2005-4602

DOI Linkhttps://doi.org/10.1007/s12541-04-0577-5

PublisherSpringer


Abstract
In this study, a compact diode laser based Micro Stereolithography (Dtc - Diode Laser Curing) system with linear stages has been developed. A suspended cross table was used to position a diode laser with a focusing lens that cures liquid photosensitive resin. Therefore the apparatus does not need complex beam forming and beam guiding, e.g., galvanometer scanner, optic fibers or similar Only one replaceable focusing lens is needed A commercial photo-curable resin was adapted by UV-absorber for p-SLA. To demonstrate the functionality Single-lines were cured with different parameters such as laser power; scan speed and absorber concentration. Afterwards, specimen with simple geometries like edges and circles were cured Thereby the limitations of roundness and sharp geometries were determined Finally, 3D-parts are built with optimized curing parameters. The results show that the new Micro-Stereolithography-System, based on diode laser and fast linear stages is suitable for an effective fabrication of 3D micro-parts.



Citation Styles

Harvard Citation styleVehseto, M. and Seitz, H. (2014) A New Micro-Stereolithography-System based on Diode Laser Curing (DLC), International Journal of Precision Engineering and Manufacturing, 15(10), pp. 2161-2166. https://doi.org/10.1007/s12541-04-0577-5

APA Citation styleVehseto, M., & Seitz, H. (2014). A New Micro-Stereolithography-System based on Diode Laser Curing (DLC). International Journal of Precision Engineering and Manufacturing. 15(10), 2161-2166. https://doi.org/10.1007/s12541-04-0577-5



Keywords


CuringDiode laserDYNAMIC MASKLinear stagesMicro stereolithographyMICROSTEREOLITHOGRAPHY

Last updated on 2025-02-04 at 02:10